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74LX1G04
LOW VOLTAGE CMOS SINGLE INVERTER WITH 5V TOLERANT INPUT
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5V TOLERANT INPUTS HIGH SPEED: tPD = 4.2ns (MAX.) at VCC = 3V LOW POWER DISSIPATION: ICC = 1A (MAX.) at TA = 25C POWER DOWN PROTECTION ON INPUTS AND OUTPUTS SYMMETRICAL OUTPUT IMPEDANCE: |IOH| = IOL = 24mA (MIN) at VCC = 3V BALANCED PROPAGATION DELAYS: tPLH tPHL OPERATING VOLTAGE RANGE: VCC(OPR) = 1.65V to 5.5V (1.2V Data Retention) IMPROVED LATCH-UP IMMUNITY
SOT23-5
SOT323-5
Flip-Chip4
DESCRIPTION The 74LX1G04 is a low voltage CMOS SINGLE INVERTER fabricated with sub-micron silicon gate and double-layer metal wiring C2MOS technology. It is ideal for 1.65 to 5.5 VCC operations and low power and low noise applications. The internal circuit is composed of 3 stages including buffer output, which provide high noise immunity and stable output. Power down protection is provided on input and output and 0 to 7V can be accepted on inputs with
ORDER CODES
PACKAGE SOT23-5L SOT323-5L Flip-Chip T&R 74LX1G04STR 74LX1G04CTR 74LX1G04BJR
no regard to the supply voltage. It can be interfaced to 5V signal environment for inputs in mixed 3.3/5V system. All inputs and outputs are equipped with protection circuits against static discharge.
PIN CONNECTION AND IEC LOGIC SYMBOLS (top view for SOT, top through view for Flip-Chip)
April 2004
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74LX1G04
INPUT AND OUTPUT EQUIVALENT CIRCUIT
PIN DESCRIPTION
PIN for SOT 1 2 4 3 5 PIN for Flip-Chip 1 3 2 4 SYMBOL N.C. 1A 1Y GND VCC Not connected Data Input Data Output Ground (0V) Positive Supply Voltage NAME AND FUNCTION
TRUTH TABLE
A L H Y H L
ABSOLUTE MAXIMUM RATINGS
Symbol VCC VI VO VO IIK IOK IO Tstg TL Supply Voltage DC Input Voltage DC Output Voltage (VCC = 0V) DC Output Voltage (High or Low State) (note 1) DC Input Diode Current DC Output Diode Current (note 2) DC Output Current Storage Temperature Lead Temperature (10 sec) Parameter Value -0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 -0.5 to VCC + 0.5 - 50 - 50 50 50 -65 to +150 260 Unit V V V V mA mA mA mA C C
ICC or IGND DC VCC or Ground Current per Supply Pin
Absolute Maximum Rating are those value beyond which damage to the device may occur. Functional operation under these condition is not implied 1) IO absolute maximum rating must be observed 2) VO < GND
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RECOMMENDED OPERATING CONDITIONS
Symbol VCC VI VO VO IOH, IOL IOH, IOL IOH, IOL IOH, IOL IOH, IOL Top dt/dv Supply Voltage (note 1) Input Voltage Output Voltage (VCC = 0V) Output Voltage (High or Low State) High or Low Level Output Current (VCC = 4.5 to 5.5V) High or Low Level Output Current (VCC = 3.0 to 3.6V) High or Low Level Output Current (VCC = 2.7 to 3.0V) High or Low Level Output Current (VCC = 2.3 to 2.7V) High or Low Level Output Current (VCC = 1.65 to 2.3V) Operating Temperature Input Rise and Fall Time (note 2) Parameter Value 1.65 to 5.5 0 to 5.5 0 to 5.5 0 to VCC 32 24 16 8 4 -55 to 125 0 to 10 Unit V V V V mA mA mA mA mA C ns/V
1) Truth Table guaranteed: 1.2V to 3.6V 2) VIN from 0.8V to 2V at VCC = 3.0V
DC SPECIFICATION
Test Condition Symbol Parameter VCC (V) 1.65 to 1.95 2.3 to 2.7 3.0 to 5.5 VIL Low Level Input Voltage 1.65 to 1.95 2.3 to 2.7 3.0 to 5.5 VOH High Level Output Voltage 1.65 to 4.5 1.65 2.3 3.0 4.5 VOL Low Level Output Voltage 1.65 to 4.5 1.65 2.3 3.0 4.5 II Ioff ICC Input Leakage Current Power Off Leakage Current Quiescent Supply Current 1.65 to 5.5 0 1.65 to 5.5 IO=-100 A IO=-4 mA IO=-8 mA IO=-16 mA IO=-24 mA IO=-32 mA IO=100 A IO=4 mA IO=8 mA IO=16 mA IO=24 mA IO=32 mA VI = 0 to 5.5V VI or VO = 5.5V VI = VCC or GND VCC-0.1 1.2 1.9 2.4 2.2 3.8 0.1 0.45 0.3 0.4 0.55 0.55 10 10 10 -40 to 85 C Min. 0.75VCC 0.7VCC 0.7VCC 0.25VCC 0.3VCC 0.3VCC VCC-0.1 1.2 1.9 2.4 2.2 3.8 0.1 0.45 0.3 0.4 0.55 0.55 10 10 10 A A A V V Max. Value -55 to 125 C Min. 0.75VCC 0.7VCC 0.7VCC 0.25VCC 0.3VCC 0.3VCC V V Max. Unit
VIH
High Level Input Voltage
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AC ELECTRICAL CHARACTERISTICS
Test Condition Symbol Parameter VCC (V) 1.65 to 1.95 2.3 to 2.7 3.0 to 3.6 4.5 to 5.5 1.65 to 1.95 2.3 to 2.7 2.7 3.0 to 3.6 4.5 to 5.5 CL (pF) RL () ts = tr (ns) -40 to 85 C Min. 2 2 1 1 2 2 1 1 1 Max. 9.5 6.5 5.5 4.1 10.5 7.5 6.1 5.5 4.2 Value -55 to 125 C Min. 2 2 1 1 2 2 1 1 1 Max. 10.5 7.6 6.5 5.5 11.5 8.5 7.1 6.5 5.2 Unit
tPLH tPHL
Propagation Delay Time
15
1M
2.0
30 30 50 50 50
1000 500 500 500 500
2.0 2.0 2.5 2.5 2.5
ns
CAPACITANCE CHARACTERISTICS
Test Condition Symbol Parameter VCC (V) 0 1.8 2.5 3.3 fIN = 10MHz Value TA = 25 C Min. Typ. 4 36.8 37 38 Max. pF pF Unit
CIN CPD
Input Capacitance Power Dissipation Capacitance (note 1)
1) CPD is defined as the value of the IC's internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average current can be obtained by the following equation. ICC(opr) = CPD x VCC x fIN + ICC
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TEST CIRCUIT
RT = ZOUT of pulse generator (typically 50)
TEST CIRCUIT AND WAVEFORM SYMBOL VALUE
Symbol 1.65 to 1.95V CL RL VIH VM tr = tr 15pF/30pF 1M/1000 VCC VCC/2 <2.0ns VCC 2.3 to 2.7V 15pF/30pF 500 VCC VCC/2 <2.0ns 2.7 to 5.5V 15pF/50pF 500 VCC VCC/2 <2.5ns
WAVEFORM: PROPAGATION DELAY (f=1MHz; 50% duty cycle)
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Figure 1 : RECOMMENDED SOLDERING REFLOW PROFILE FOR LEADFREE FLIP-CHIP MOUNTING ON PCB
Temperature (C)
260C max 255C 220C 180C 125 C
2C/s recommended 2C/s recommended 6C/s max 6C/s max
3C/s max 3C/s max
0 0 1 2 3 4 5
10-30 sec 90 to 150 sec 90 sec max
6
7
Time (min)
For Flip-Chip mounting on the PCB, STMicroelectronics recommends the use of a solder stencil aperture of 330 x 330 m maximum and a typical stencil thickness of 125m. Flip-Chips are fully compatible with the use of near eutectic 95.5Sn 4Ag 0.5Cu solder paste with no clean flux. ST's recommendations for Flip-Chip board mounting are illustrated on the soldering reflow profile shown in figure 1 below. Dwell time in the soldering zone (with temperature higher than 220C) has to be kept as short as possible to prevent component and substrate damages. Peak temperature must not exceed 260C. Controlled atmosphere (N2 or N2H2) is recommended during the whole reflow, specially above 150C. Flip-Chips are able to withstand three times the previous recommended reflow profile in order to be compatible with a double reflow when SMDs are mounted on both sides of the PCB plus one additional repair. A maximum of three soldering reflows are allowed for these leadfree packages (with repair step included). The use of a no clean flux is highly recommended to avoid any cleaning operation. In order to prevent any bump cracks, ultrasonic cleaning methods are not recommended.
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SOT23-5L MECHANICAL DATA
mm. DIM. MIN. A A1 A2 b C D E e H L 2.60 0.10 0.90 0.00 0.90 0.35 0.09 2.80 1.50 0.95 3.00 0.60 102.3 3.9 TYP MAX. 1.45 0.10 1.30 0.50 0.20 3.00 1.75 MIN. 35.4 0.0 35.4 13.7 3.5 110.2 59.0 37.4 118.1 23.6 TYP. MAX. 57.1 3.9 51.2 19.7 7.8 118.1 68.8 mils
.
7049676C
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SOT323-5L MECHANICAL DATA
mm. DIM. MIN. A A1 A2 b C D E E1 e e1 L 0.10 0.80 0.00 0.80 0.15 0.10 1.80 1.80 1.15 0 .65 1.3 0.30 3.9 TYP MAX. 1.10 0.10 1.00 0.30 0.18 2.20 2.40 1.35 MIN. 31.5 0.0 31.5 5.9 3.9 70.9 70.9 45.3 25.6 51.2 11.8 TYP. MAX. 43.3 3.9 39.4 11.8 7.1 86.6 94.5 53.1 mils
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Flip-Chip4 MECHANICAL DATA
mm. DIM. MIN. A A1 A2 b D D1 E E1 1.02 0.265 1.02 0.585 0.21 TYP 0.65 0.25 0.40 0.315 1.07 0.5 1.07 0.5 1.12 40.15 0.365 1.12 10.43 40.15 MAX. 0.715 0.29 MIN. 23.03 8.27 TYP. 25.59 9.84 15.75 12.40 42.13 19.69 42.13 19.69 44.09 14.37 44.09 MAX. 28.15 11.42 mils
7224716/D
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Tape & Reel SOT23-xL MECHANICAL DATA
mm. DIM. MIN. A C D N T Ao Bo Ko Po P 3.13 3.07 1.27 3.9 3.9 3.23 3.17 1.37 4.0 4.0 12.8 20.2 60 14.4 3.33 3.27 1.47 4.1 4.1 0.123 0.120 0.050 0.153 0.153 0.127 0.124 0.054 0.157 0.157 13.0 TYP MAX. 180 13.2 0.504 0.795 2.362 0.567 0.131 0.128 0.0.58 0.161 0.161 0.512 MIN. TYP. MAX. 7.086 0.519 inch
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Tape & Reel SOT323-xL MECHANICAL DATA
mm. DIM. MIN. A C D N T Ao Bo Ko Po P 3.9 3.8 2.25 2.7 1.2 4 4 4.1 4.2 0.153 0.149 175 12.8 20.2 59.5 60 60.5 14.4 0.088 0.106 0.047 0.157 0.157 0.161 0.165 TYP 180 13 MAX. 185 13.2 MIN. 6.889 0.504 0.795 2.362 0.567 TYP. 7.086 0.512 MAX. 7.283 0.519 inch
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Tape & Reel Flip-Chip 4 MECHANICAL DATA
mm. DIM. MIN. A C D N T Ao Bo Ko Po P 1.12 1.12 0.68 3.9 3.9 1.17 1.17 0.73 4 4 12.8 20.2 59 60 61 8.4 1.22 1.22 0.78 4.1 4.1 0.044 0.044 0.027 0.153 0.153 0.046 0.046 0.029 0.157 0.157 TYP MAX. 178 13.2 0.504 0.795 2.323 2.362 2.401 0.331 0.048 0.048 0.031 0.161 0.161 MIN. TYP. MAX. 6.926 0.519 inch
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners (c) 2004 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com
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